The effect of wax emulsion varying in concentration from 0 to 1.5% at 0.5% increments on the strength and dimensional stability of urea formaldehyde bonded particleboard at three glue levels, 8%, 10% and 12% has been observed. Results show that the addition of wax emulsion is useful to manufacture particleboard at low glue level, viz., 8% and 10%. But it does notshow any appreciable effect on the board made with 12% glue.

The properties of particleboards improve with increasing addition of wax emulsion for 8% glue and for 10% glue, the addition of 1% wax has beneficial effect on all the properties under investigation. Beyond this, further improvement is not marked. A combination of 10% glue and 1% wax is found advantageous to manufacture strong particleboard having good dimensional stability.